
Intern - IT Software Engineer
Micron Technology6 days ago
Boise, ID, USAIntern
H1B sponsor
Responsibilities
- Design, code, test, and debug software applications using various technologies, tools, and artificial intelligence.
- Implement new features and enhancements for Fab equipment and tools.
- Support, troubleshoot, and resolve software issues and bugs.
- Document and update software specifications and user manuals.
- Research and evaluate new technologies and best practices.
- Participate in code reviews and team meetings.
Requirements
- Currently pursuing a bachelor’s degree in Computer Science, Software Engineering, or a related field and continuing education in Fall 2027.
- Understanding of ITIL Incident, Release, Change, and Problem Management practices.
- Knowledge of software engineering principles and methodologies such as Agile Scrum or Kanban.
- Strong communication and social skills with the ability to work independently and collaboratively.
- Ability to learn quickly and adapt to changing requirements.
- Preferred: proficiency with Perl or Python, Unix-like operating systems, application programming interfaces, Git, Azure DevOps, software testing tools, DevOps tools, and Splunk.
Benefits
- Hands-on experience, mentorship, feedback, and real-world projects affecting Fab equipment performance and efficiency.
- Opportunity to improve a resume and portfolio through project achievements.
- Academic credit or a stipend depending on school policy.
- Medical, dental, and vision plans, income protection programs, paid family leave, paid time off, and paid holidays.
About Micron Technology
Micron Technology designs and manufactures memory and storage semiconductors—DRAM, NAND, NOR and SSDs—sold to device makers, cloud providers, and embedded/automotive markets. Founded in 1978 and headquartered in Boise, Idaho, it operates globally and sells under the Micron and Crucial brands as a public company (NASDAQ: MU). Its products support data center, AI, mobile, and PC systems, including high-bandwidth and multichip packages for performance- and space-constrained applications.