Boyd Corporation

Software Engineer

Boyd Corporation
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3 months ago
Fredericksburg, VA, USASenior

Responsibilities

  • Develop embedded and application-level software for high-performance thermal control systems.
  • Collaborate with multidisciplinary teams on thermal control products involving control algorithms and hardware.
  • Complete full-lifecycle development and support of custom thermal control application software.
  • Support proof-of-concept studies and maintain and enhance existing thermal product software.
  • Develop application and driver software using Python, JavaScript, C#, or other high-level languages for Linux and Windows.
  • Program user interfaces using Qt, Visual C, or similar toolsets.

Requirements

  • Bachelor’s degree or higher in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field.
  • At least 5 years of related experience.
  • At least 4 years of software development experience using higher-level programming languages.
  • Preferred experience configuring Docker or similar container platforms for Linux.
  • Preferred experience with MODBUS, BACnet, or other Fieldbus protocols.
  • Preferred experience with high-reliability coding practices in industrial, automotive, or aerospace environments.
  • Candidates must reside within a 60-mile radius of Fredericksburg, Virginia; active duty military are exempt.

Benefits

  • The role is on-site in Fredericksburg, Virginia.
  • Relocation is currently not offered.

Tech Stack

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Boyd Corporation

About Boyd Corporation

1,001-5,000 employees

Boyd Corporation designs and manufactures engineered materials and thermal management solutions for OEMs across electronics, automotive, aerospace, and healthcare. Its products include gaskets and sealing, adhesives, die-cut components, and cooling systems such as two-phase and liquid cooling. Headquartered in Pleasanton, California, the privately held company is owned by Goldman Sachs and operates a global manufacturing and converting footprint serving high-reliability and high-performance applications.

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