Micron Technology

SOFTWARE ENGINEER

Micron Technology
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22 hours ago
Tainan, TaiwanMid Level

Responsibilities

  • Analyze customer and business needs, document current and future process flows, and capture requirements with business analysts and project managers.
  • Evaluate software options, consult enterprise architects, and contribute to cost, decision, schedule, and resource analyses.
  • Design, implement, test, document, and deploy software solutions through the software development lifecycle.
  • Provide worldwide 24x7 software support, resolve issues, act as the subject-matter expert and final escalation point, and document defects and enhancements.
  • Maintain technical skills, research industry practices, recommend IT roadmap changes, and collaborate with global multifunctional teams on semiconductor automation solutions.
  • Train and mentor support team members and identify responsible AI-enabled improvements to work processes.

Requirements

  • Bachelor’s degree or above in Information Engineering, Industrial Engineering, or a related field.
  • Application development experience is preferred, with interest in system development, maintenance, and performance improvement.
  • Familiarity with Perl and Linux is required or expected.
  • TCL, Java, C#, Python, and C/C++ experience is preferred.
  • Semiconductor FAB system development experience is preferred.
  • Good English language skills are required.
  • AI-related skills and experience, including LLMs, agents, Agentic AI, Cloud Assist, or Copilot, are highly preferred.

Tech Stack

Categories

Micron Technology

About Micron Technology

10,000+ employees

Micron Technology designs and manufactures memory and storage semiconductors—DRAM, NAND, NOR and SSDs—sold to device makers, cloud providers, and embedded/automotive markets. Founded in 1978 and headquartered in Boise, Idaho, it operates globally and sells under the Micron and Crucial brands as a public company (NASDAQ: MU). Its products support data center, AI, mobile, and PC systems, including high-bandwidth and multichip packages for performance- and space-constrained applications.

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