
Software Development Engineer
Micron Technology1 day ago
Responsibilities
- Develop and maintain automation software systems supporting semiconductor manufacturing operations and automated material handling systems.
- Gather requirements and assist with prioritizing new hosts and host enhancements.
- Coordinate tool time for automation testing and upgrades with automation developers and tool owners.
- Provide expertise for GeRM, ET, and Sigma setup while new hosts and enhancements are designed and tested.
- Participate in automation projects involving BiRD, RPA, and FDC and support automation alignment across 300mm fabs.
- Debug automation problems in a daily support role and help implement solutions that improve software resiliency.
- Provide testing for manufacturing application releases including ECR and DAW.
- Maintain procedures, protocols, training documentation, and weekly project status reports.
- Support software development teams in defining requirements for enhancements and solve problems involving manufacturing systems and support tools.
Requirements
- Bachelor’s degree in Computer Science, Electronics Engineering, or a related field.
- Proficiency with Perl or Python scripting languages.
- Experience developing SQL.
- Knowledge of software architecture and the software development lifecycle.
- Knowledge of the Scrum development process.
- Knowledge of software testing.
Benefits
- Medical, dental, and vision plan options.
- Income protection benefits for illness or injury and paid family leave.
- Paid time off and paid holidays.
- Equal opportunity and affirmative action employment practices.
About Micron Technology
Micron Technology designs and manufactures memory and storage semiconductors—DRAM, NAND, NOR and SSDs—sold to device makers, cloud providers, and embedded/automotive markets. Founded in 1978 and headquartered in Boise, Idaho, it operates globally and sells under the Micron and Crucial brands as a public company (NASDAQ: MU). Its products support data center, AI, mobile, and PC systems, including high-bandwidth and multichip packages for performance- and space-constrained applications.