Qualcomm

Interim Engineering Intern_2027_SW

Qualcomm
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2 months ago
Hyderābād, IndiaIntern
H1B Sponsor

Responsibilities

  • Develop real-time embedded software and device drivers.
  • Develop mobile software for Windows Mobile, Android, or Linux.
  • Develop multimedia software stacks, firmware, and drivers for audio, video, and imaging technologies.
  • Develop wireless modem, connectivity, and communication protocol stack software and firmware.
  • Develop Linux kernels, board support packages, and device drivers.
  • Develop application software and user interfaces for embedded platforms.
  • Design software architecture and develop object-oriented software for embedded Android and Windows devices.

Requirements

  • Bachelor’s or master’s degree in Computer Science Engineering, Communication Engineering, or Electronics and Communication Engineering.
  • Knowledge of operating system concepts and data structures.
  • Proficiency in C/C++ and object-oriented design.
  • Understanding of Linux/UNIX, Linux drivers, or Linux kernel development.
  • Familiarity with wireless network standards such as CDMA, GSM, UMTS, and LTE.
  • Knowledge of protocols such as TCP, UDP, IP, SIP, and RTP.
  • Understanding of multimedia technologies including audio, video, and imaging.
  • Strong analytical and problem-solving skills.
  • Ability to collaborate and work effectively in teams.
  • Good verbal and written communication skills.

Benefits

  • Internship opportunities are available in Hyderabad, Bangalore, Chennai, and Noida, India.
  • Qualcomm provides reasonable accommodations during the application and hiring process for individuals with disabilities.

Tech Stack

Categories

Qualcomm

About Qualcomm

10,000+ employees

Inspired by 250 years of American ingenuity, we build technologies that expand what’s possible. From wireless to AI at scale and 6G, our innovations power progress worldwide.

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