Principal Engineer, BSP
HARMAN InternationalResponsibilities
- Develop, integrate, and maintain BSP, kernel, and device driver software for Cockpit and Central Compute platforms.
- Support platform bring-up, board support package customization, performance optimization, and production software releases.
- Develop and debug software across Linux, Android, and/or QNX operating systems.
- Collaborate with SoC suppliers, hardware teams, architects, and application teams to resolve complex system issues.
- Drive feature development and troubleshooting across domains including virtualization, USB, camera, Ethernet, display, graphics, audio, and power management.
- Support system integration, vehicle validation, customer issue investigation, and field issue resolution.
- Work effectively in global, cross-functional engineering teams and support customer activities with occasional international travel.
Requirements
- Bachelor's degree or above in Computer Science, Software Engineering, Electrical Engineering, or a related discipline.
- At least 3 years of embedded software development experience, including BSP, kernel, or device driver development.
- Required hands-on experience with Qualcomm automotive platforms such as SA8155, SA8295, Gen4, Gen5, or equivalent.
- Strong kernel development experience in Linux, Android, and/or QNX.
- Strong C/C++ programming and debugging skills.
- Experience with BSP bring-up, boot processes, device drivers, interrupt handling, memory management, and system performance optimization.
- Familiarity with at least one of virtualization, USB, camera, Ethernet, display, graphics, audio, or power management.
- Experience with development and debugging tools such as GDB, JTAG, Lauterbach, Trace32, or performance analysis tools.
- Experience working on production automotive programs and cross-functional development teams, with fluent English communication skills.
- Preferred experience includes NVIDIA automotive platforms, Orin, Thor, DriveOS, QNX Hypervisor, KVM, Xen, Jailhouse, Automotive Ethernet, AVB/TSN, SOME/IP, networking stacks, ISO 26262, ISO/SAE 21434, ASPICE, and premium OEM programs.
Benefits
- Hybrid work environment with most office-based roles onsite four days per week, where applicable.
- Employee discounts on HARMAN products including JBL, Harman / Kardon, and AKG.
- Learning and development opportunities through HARMAN University.
- Wellness benefits, campus fitness center, and cafeteria where available.
- Inclusive and diverse work environment supporting professional and personal development.
About HARMAN International
Headquartered in Stamford, Connecticut, HARMAN (harman.com) designs and engineers connected products and solutions for automakers, consumers, and enterprises worldwide, including connected car systems, audio and visual products, enterprise automation solutions; and services supporting the Internet of Things. With leading brands including AKG®, Harman Kardon®, Infinity®, JBL®, Lexicon®, Mark Levinson® and Revel®, HARMAN is admired by audiophiles, musicians and the entertainment venues where they perform around the world. More than 50 million automobiles on the road today are equipped with HARMAN audio and connected car systems. Our software services power billions of mobile devices and systems that are connected, integrated and secure across all platforms, from work and home to car and mobile. HARMAN has a workforce of approximately 30,000 people across the Americas, Europe, and Asia. In March 2017, HARMAN became a wholly-owned subsidiary of Samsung Electronics Co., Ltd. HARMAN is an Equal Opportunity, Affirmative Action employer. Minorities, women, veterans and individuals with disabilities are encouraged to apply. HARMAN offers a great work environment, challenging career opportunities, professional training and competitive compensation. Looking for a challenge where your experience is valued? Come see what you can achieve as a leader with HARMAN!