Software Lead Engineer
Applied Materials3 months ago
Singapore, SingaporeMid Level / Senior
Responsibilities
- Design and develop code for complex software solutions supporting semiconductor equipment components and devices.
- Develop software documentation and test procedures.
- Troubleshoot difficult software problems and design and implement bug fixes.
- Define software specifications and test plans for simulators, test benches, or laboratory environments.
- Communicate with internal and external customers regarding requirements, project schedules, and software troubleshooting.
- Lead small projects as needed.
Requirements
- Bachelor’s degree in computer science or a related field such as computer science, information management, software or systems engineering, cybersecurity, or mathematics.
- 4–7 years of related experience.
- Proficiency and experience with C/C++, .NET, C#, operating systems, networking principles, algorithms, multithreading, and RPC.
- Master’s degree in a related field preferred.
- Strong knowledge of industry best practices, key business drivers, and how the area of expertise integrates with other areas preferred.
- Leadership skills for leading small projects preferred.
Benefits
- Full-time regular employment.
- Location in Singapore, SGP.
- 10% travel required.
- Relocation eligible.
- Supportive learning, development, health, and wellbeing programs.],
- h1b_sponsorship_status
- unknown
- h1b_sponsorship_evidence
- tech_stack
- category_rationale
- The role’s core function is designing, developing, testing, and troubleshooting software for semiconductor equipment.
- category
- Software Engineering
- specialties
- seniority_rationale
- The Lead Engineer title and stated responsibility to lead small projects indicate a leadership-level role, while the required experience spans 4–7 years.
- seniority
- credential_category
- bachelor-degree
- months_of_experience
- experience_in_place_of_education
- salary
- tech_stack
About Applied Materials
Applied Materials builds semiconductor and display manufacturing equipment and related materials engineering technologies used by chip and flat-panel makers. It sells capital tools, process technology, and lifecycle services and software to support high-volume wafer fabrication and display production worldwide. Founded in 1967 and headquartered in Santa Clara, California, the company is publicly traded on NASDAQ under the ticker AMAT.