Micron Technology

Intern - IT Software Engineer

Micron Technology
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1 day ago
Boise, ID, USAIntern
H1B sponsor

Responsibilities

  • Collaborate with a software development team and worldwide IT stakeholders.
  • Use the software development lifecycle to deliver quality-driven solutions.
  • Design and develop utilities, tools, and frameworks supporting the data factory.
  • Create software for applications supporting Micron’s Business Data Warehouse.
  • Develop solutions that meet customer needs and add business value.

Requirements

  • Currently pursuing a bachelor’s or master’s degree in Computer Science or a related field, with a master’s preferred.
  • Strong knowledge of data structures, algorithms, relational, NoSQL, and graph databases, and SQL.
  • Proficiency in object-oriented programming and languages such as C# and Python.
  • Understanding of software architecture concepts.
  • Ability to learn new technologies and programming languages while managing priorities in a fast-paced environment.
  • Strong analytical, communication, interpersonal, and teamwork skills.
  • Basic understanding of agentic AI.
  • Preferred: knowledge of Snowflake, Tableau, Power BI, JavaScript, React, and AI-enabled code generation or review.

Benefits

  • Medical, dental, and vision plan options.
  • Income protection programs for illness or injury.
  • Paid family leave.
  • Paid time off and paid holidays.
  • Professional growth opportunities.
  • US applicants may request application assistance or reasonable accommodations.

Tech Stack

Categories

Micron Technology

About Micron Technology

10,000+ employees

Micron Technology designs and manufactures memory and storage semiconductors—DRAM, NAND, NOR and SSDs—sold to device makers, cloud providers, and embedded/automotive markets. Founded in 1978 and headquartered in Boise, Idaho, it operates globally and sells under the Micron and Crucial brands as a public company (NASDAQ: MU). Its products support data center, AI, mobile, and PC systems, including high-bandwidth and multichip packages for performance- and space-constrained applications.

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