3 days ago
San Jose, CA, USAIntern
H1B sponsor
Responsibilities
- Conduct feasibility studies for advanced DUV and EUV imaging technologies.
- Support computational lithography investigations through modeling, simulation, and data analysis.
- Perform prototype testing and generate technical data to evaluate imaging concepts and software features.
- Develop and enhance software functionality based on customer requirements and product specifications.
- Create and maintain user guides, engineering reports, and other technical documentation.
- Analyze simulation results and communicate findings to engineering teams.
- Collaborate with software engineers, imaging specialists, and product teams on ongoing development.
Requirements
- Currently pursuing a bachelor's or master's degree in Computer Science, Electrical Engineering, Physics, Applied Mathematics, Optical Engineering, or a related technical field.
- Be a junior, senior, or graduate-level student.
- Have experience through coursework, research, academic projects, or internships related to imaging, lithography, simulation, software development, or data analysis.
- Have familiarity with technical computing tools such as Python, MATLAB, or similar programming environments.
- Exposure to machine learning, optimization methods, scientific computing, or data analytics is preferred.
Tech Stack
MATLABPython
Categories
Product Engineering
About ASML
ASML designs and builds extreme ultraviolet (EUV) and deep ultraviolet (DUV) photolithography machines, along with control software and lifecycle services, used by chipmakers to mass-produce microchips. Its revenue comes primarily from system sales and installed-base service contracts. Founded in 1984 and headquartered in Veldhoven, Netherlands, ASML supplies major semiconductor manufacturers, including TSMC, Samsung, and Intel.