Tapeout Engineer, 2026 New College Graduate
GlobalFoundries2 hours ago
Base Salary
$58k - $101k/yr
Responsibilities
- Enable scalable Electronic Design Automation functions in cloud environments.
- Develop tapeout data pipelines, validation frameworks, process-improvement automations, and KPI metrics.
- Create data visualizations and tools for viewing EDA outputs and improving tapeout processes.
- Analyze tapeout processing KPIs and system performance to optimize cloud tapeout execution.
- Support customer tapeouts, mask manufacturing enablement, and fab wafer-start enablement.
- Contribute to data migration, mapping, reconciliation, modeling, validation, governance, and cross-system integration.
- Partner with product lines, manufacturing fabs, EDA teams, IT, product owners, and data architects.
- Perform activities safely and support Environmental, Health, Safety, and Security programs.
Requirements
- Graduating with a bachelor’s degree in electrical and computer engineering, data science, or a related field from an accredited program.
- Minimum overall 3.5 GPA and demonstrated good academic standing.
- Knowledge of Python, Angular, QuickSight, PowerApps, cloud platforms, and relational and non-relational databases.
- Knowledge of developing cloud-based business process improvement tools using out-of-the-box services.
- Knowledge of project lifecycles and exposure to ADO, JIRA, Bamboo, Git, and Jenkins.
- English fluency in written and verbal communication.
- Prior related internship or co-op experience is preferred.
- Leadership experience, project management skills, communication skills, planning and organizational skills, and a proactive continuous-improvement mindset are preferred.
- Semiconductor foundry domain knowledge is a plus.
Benefits
- Full-time 2026 new college graduate employment with accelerated training in a fast-paced environment.
- Mentorship, networking, leadership opportunities, cross-functional collaboration, and talent mobility.
- Hands-on ownership of tapeout data ecosystems and exposure to the full customer tapeout lifecycle.
- Work involving global teams and semiconductor design, data exchange, execution, and mask manufacturing operations.