Micron Technology

Engineer, Firmware Test (SSD)

Micron Technology
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2 days ago
Singapore, SingaporeMid Level

Responsibilities

  • Build comprehensive firmware verification plans for SSD firmware features.
  • Develop white-box, grey-box, known-system, and closed-system testing methods.
  • Analyze weekly regression failures and perform root-cause analysis.
  • Communicate technical challenges, solutions, and mitigation plans to cross-functional management.
  • Participate in code reviews and collaborate with firmware development engineers to improve code quality.
  • Use AI-assisted tools responsibly to improve efficiency, quality, and effectiveness.
  • Identify, test, and share AI-enabled process improvements.

Requirements

  • Bachelor of Science in Electrical Engineering, Computer Engineering, or Computer Science.
  • 2-3 years of experience in test development and validation, with internship or academic project experience counting.
  • Familiarity with white-box, grey-box, black-box, boundary, and regression testing concepts.
  • Strong Python programming skills, including scripting, debugging, and test framework development.
  • Familiarity with Git development flow and branch management.
  • Knowledge of PCIe, NVMe, NVMe-MI, and OCP storage protocols is advantageous.
  • Ability to work independently on complex tasks with minimal supervision.
  • Strong problem-solving, analytical, interpersonal, communication, organizational, and teamwork skills.
  • Ability to use AI-enabled tools responsibly and effectively.

Tech Stack

Categories

Micron Technology

About Micron Technology

10,000+ employees

Micron Technology designs and manufactures memory and storage semiconductors—DRAM, NAND, NOR and SSDs—sold to device makers, cloud providers, and embedded/automotive markets. Founded in 1978 and headquartered in Boise, Idaho, it operates globally and sells under the Micron and Crucial brands as a public company (NASDAQ: MU). Its products support data center, AI, mobile, and PC systems, including high-bandwidth and multichip packages for performance- and space-constrained applications.

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