Software Engineer Chip Package Board Codesign (f/m/div)
Infineon Technologies2 months ago
Bucharest, RomaniaMid Level
Responsibilities
- Develop and maintain Java, Python, and Kotlin software solutions for EDA tools, custom layouts, and design-flow automation.
- Create Python, Makefile, and Bash scripts to improve design workflows and infrastructure.
- Develop and support CI/CD pipelines using Jenkins or GitLab.
- Provide technical support and enhancements for custom tools using technologies such as TCL, Perl, and Skill/LISP.
- Collaborate with chip, package, and PCB layout development teams to understand technical workflow requirements.
- Analyze and optimize software frameworks and integrate new solutions for design teams.
Requirements
- Bachelor’s, master’s, or Ph.D. degree in Electrical Engineering or a related technical field.
- At least 3 years of professional software development experience and a strong foundation in software engineering principles.
- Strong programming skills in Java, Python, and Kotlin, applied to electronic design automation.
- Strong Python scripting skills for automation workflows and infrastructure tools.
- Foundational understanding of electrical engineering concepts relevant to semiconductor workflows.
- Experience with chip, package, or PCB layout.
- Familiarity with physical design workflows is advantageous.
- Applicants should submit a CV in English.
About Infineon Technologies
Infineon Technologies designs and manufactures semiconductors for automotive, industrial, and IoT applications, including power devices, microcontrollers, sensors, and security ICs. The Germany-based public company, spun out of Siemens in 1999 and headquartered in Neubiberg near Munich, sells chips and reference solutions to OEMs and device makers worldwide. It trades on the Frankfurt Stock Exchange (ETR: IFX) and expanded its portfolio with the 2020 acquisition of Cypress Semiconductor.