1 day ago
Santa Clara, CA, USAIntern
H1B sponsor
Responsibilities
- Develop and maintain embedded firmware for data center, AI device, SSD controller, DSP networking, and PAM4 DSP hardware platforms.
- Design and implement device drivers and firmware features for SPI, I2C, I3C, UART, MDIO, PCIe, and NVMe communication protocols and RTOS-based systems.
- Participate in the product lifecycle from concept and design through implementation, testing, validation, and customer release.
- Create automation scripts in Python, shell, and bash for testing, failure analysis, and infrastructure management.
- Develop provisioning software and trusted firmware stacks supporting SoC security features, cryptography, and secure protocols.
- Collaborate with hardware, system, QA, and customer solutions teams on integration, debugging, and performance optimization.
- Design and execute unit, system, and integration tests, including regression planning and Jenkins continuous integration.
- Support lab testing, data analysis, debugging tool development, proof-of-concept preparation, and customer documentation.
- Debug complex hardware/software issues, perform root cause analysis, and manage fixes through issue tracking systems such as Jira.
Requirements
- Currently enrolled in a master’s degree program in computer engineering, electrical engineering, or a related field, with expected graduation between Fall 2027 and Summer 2028.
- Proficiency in Python and/or C.
- Understanding of computer architecture, networking fundamentals including the OSI model and TCP/IP, and/or embedded systems.
- Ability to work in Windows or Linux-based development environments.
- Knowledge or experience with Git, GitHub, or Gerrit; Linux, Makefiles, GDB, IDEs, and bash scripting.
- Knowledge of ARM CPU, RISC-V, TrustZone, Caliptra, or Trusted Firmware.
- Knowledge of RTOS architecture, device drivers, and communication protocols including SPI, I2C, I3C, UART, USB, PCIe, and MDIO.
- Knowledge of security protocols including IPSec, TLS/SSL, SPDM, digital certificates, and cryptography.
- Knowledge of DSP concepts such as equalizers, filters, ADC, DAC, FFE, and DFE.
- Knowledge of Python or bash scripting, Jenkins CI, software regression planning, GUI development, lab automation, and customer SDKs.
- Knowledge of Ethernet, SERDES, switches, routers, unit testing, system integration, and debugging tools.
- Strong problem-solving, verbal communication, and written communication skills.
Benefits
- Intern benefits include medical, dental, and vision coverage, perks and discounts, mental health resources, and paid holidays.
- Additional compensation may be available for intern PhD candidates.
- This is a Summer 2027 internship for students expected to graduate between Fall 2027 and Summer 2028.
About Marvell
Marvell designs and sells semiconductors for data infrastructure, including Ethernet switching and PHYs, optical and 5G connectivity, storage controllers, and custom compute silicon (ASICs/DPUs) used by cloud providers, telecom carriers, and enterprise OEMs. Its business model centers on selling chips and platform solutions and co-developing custom silicon with major customers. Founded in 1995 and headquartered in Santa Clara, it is a public company traded on NASDAQ (MRVL).