
Staff GenAI Engineer - AMS Design and Optimization
Micron Technology3 days ago
Base Salary
$170k - $290k/yr
Responsibilities
- Embed AI and automation into circuit design, layout, and verification workflows.
- Apply data-driven methods to modeling, validation, and reducing tape-out iterations.
- Enable AI-assisted optimization of floorplanning, placement, routing, and simulation.
- Use historical design and silicon data to generate predictive insights.
- Collaborate with design, CAD, product, manufacturing, and other engineering teams to scale AI-enabled methods.
Requirements
- Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or equivalent practical experience.
- 5 to 7 years of experience with circuit design, layout, verification, or CAD flows.
- Strong coding skills and the ability to develop and maintain production-quality software in Python or similar languages.
- Experience applying data analysis, machine learning, or automation to engineering workflows.
- Preferred: Master’s degree or PhD in Electrical Engineering, Computer Science, or a related field.
- Preferred: experience applying AI or machine learning to physical design, simulation, or silicon data.
- Preferred: knowledge of memory circuit design and full-chip integration.
- Preferred: experience collaborating across design, process integration, test, or product engineering.
Benefits
- Medical, dental, and vision plans.
- Income protection benefits for illness or injury.
- Paid family leave.
- Paid time off and paid holidays.
- Additional compensation may include benefits, bonuses, and equity.
Tech Stack
Categories
About Micron Technology
Micron Technology designs and manufactures memory and storage semiconductors—DRAM, NAND, NOR and SSDs—sold to device makers, cloud providers, and embedded/automotive markets. Founded in 1978 and headquartered in Boise, Idaho, it operates globally and sells under the Micron and Crucial brands as a public company (NASDAQ: MU). Its products support data center, AI, mobile, and PC systems, including high-bandwidth and multichip packages for performance- and space-constrained applications.