Engineer / Senior Engineer - STPG PE Firmware
Micron Technology2 days ago
Singapore, SingaporeSenior
Responsibilities
- Collaborate with system product, test process, media algorithm, and hardware teams to define and understand test requirements.
- Develop manufacturing firmware to test and characterize SSDs during development.
- Improve manufacturing test coverage and reduce test time through code optimization and new test methodologies.
- Coordinate manufacturing firmware release and validation strategies for production integration.
- Introduce test cases to maintain consistent coverage across market segments.
- Ensure SSD functionality, usability, quality, reliability, and performance through firmware development.
- Support NAND system failure analysis and isolate root causes of NAND failures in system environments.
- Use AI-assisted tools and insights to improve engineering efficiency, quality, and effectiveness.
Requirements
- PhD, master’s, or bachelor’s degree in Electrical Engineering, Electronic Engineering, Computer Engineering, or a related field.
- Experience in firmware development and testing.
- Experience with C or C++ and Python programming.
- Experience with RTOS or ARM with multi-core processing operating systems.
- Ability to collaborate effectively with cross-functional teams and apply strong analytical skills to improve test procedures.
- Ability to use AI-assisted development tools for firmware development or debugging.
- NAND flash memory technology experience is preferred.
- High-volume manufacturing experience is preferred.
- Storage-interface experience such as PCIe is preferred.
About Micron Technology
Micron Technology designs and manufactures memory and storage semiconductors—DRAM, NAND, NOR and SSDs—sold to device makers, cloud providers, and embedded/automotive markets. Founded in 1978 and headquartered in Boise, Idaho, it operates globally and sells under the Micron and Crucial brands as a public company (NASDAQ: MU). Its products support data center, AI, mobile, and PC systems, including high-bandwidth and multichip packages for performance- and space-constrained applications.