1 day ago
Responsibilities
- Provide technical leadership for software design, development, integration, validation, and delivery for advanced packaging and hybrid bonding equipment.
- Influence software architecture decisions for scalability, maintainability, performance, and long-term product evolution.
- Develop, troubleshoot, review, and maintain high-quality C++ software.
- Lead complex software features and subsystems from requirements through implementation, integration, validation, and release.
- Support development planning, customer-oriented software baseline management, and release execution.
- Collaborate with software quality, hardware, controls, process, and system engineering teams.
- Diagnose software and system-level issues involving hardware, robotics, motion control, automation, and process systems.
- Champion software design, code reviews, testing, build management, configuration management, and version control practices.
- Mentor software engineers and provide technical guidance on architecture, design, code reviews, and engineering standards.
- Contribute to software technology direction, architecture evolution, and continuous improvement.
Requirements
- Bachelor’s or master’s degree in computer science, software engineering, computer engineering, or a related field.
- 8+ years of relevant software development experience with demonstrated technical leadership in complex software systems.
- Strong hands-on C++ software development expertise.
- Experience developing software interacting with complex hardware, equipment, robotics, motion control, automation, or real-time systems.
- Experience with customer-oriented software baseline management and release planning.
- Ability to influence software architecture and technical direction in line with long-term product and business needs.
- Ability to lead complex technical work and collaborate across software, hardware, process, and system engineering teams.
- Hands-on experience with Jira, build management tools, and Git version control.
- Exposure to advanced packaging process flows such as CoWoS, SoIC, or InFO.
- Semiconductor process equipment industry experience is preferred.
- Experience in fast-paced, customer-driven, rapidly evolving environments is preferred.
- Ability to manage multiple concurrent technical priorities and demanding timelines is preferred.
- Demonstrated ability to mentor engineers and elevate technical standards through architecture guidance, design reviews, code reviews, and hands-on technical leadership is preferred.
About ASM
ASM designs and manufactures wafer-processing equipment for semiconductor manufacturers, with a focus on thin‑film deposition technologies such as atomic layer deposition, epitaxy, and chemical vapor deposition. The Dutch company sells and services tools used in advanced logic, memory, and power-device production. Founded in 1968 and headquartered in Almere, it is a public company listed in Amsterdam, operating globally through R&D centers and customer support sites near major fabs.