Micron Technology

Intern- Solutions Engineer

Micron Technology
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12 hours ago
Singapore, SingaporeIntern

Responsibilities

  • Develop Python-based automation prototypes, scripts, and notebooks.
  • Create proof-of-concept AI agents for intake, classification, and query workflows.
  • Explore predictive modeling techniques using sample or historical datasets.
  • Develop prototype connectors and data pipelines for knowledge integration use cases.
  • Evaluate AI model behavior through controlled testing and analysis.
  • Document architecture patterns, design decisions, and project learnings.
  • Present the project approach, outcomes, and learnings at the end of the internship.

Requirements

  • Be a student or recent graduate in Computer Science, Data Science, Software Engineering, Information Technology, Industrial Engineering, or a related technical discipline.
  • Demonstrate programming fundamentals with an emphasis on Python.
  • Have a basic understanding of software development concepts.
  • Show interest in AI, automation, and data-driven systems.
  • Demonstrate analytical thinking and problem-solving ability.

Benefits

  • Structured mentorship and guidance from senior Solutions Engineers and Process Architects.
  • Hands-on exposure to AI agents, automation workflows, predictive modeling, data pipelines, API-based integration, and Knowledge Lake architecture.
  • Project-based, full-semester internship with a minimum duration of six months.
  • Work in a controlled, non-production environment with a final technical project presentation.

Tech Stack

Categories

Solutions Engineering
Micron Technology

About Micron Technology

10,000+ employees

Micron Technology designs and manufactures memory and storage semiconductors—DRAM, NAND, NOR and SSDs—sold to device makers, cloud providers, and embedded/automotive markets. Founded in 1978 and headquartered in Boise, Idaho, it operates globally and sells under the Micron and Crucial brands as a public company (NASDAQ: MU). Its products support data center, AI, mobile, and PC systems, including high-bandwidth and multichip packages for performance- and space-constrained applications.

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