1 day ago
Santa Clara, CA, USAIntern
H1B sponsor
Responsibilities
- Design, develop, and debug embedded software in C and C++ for Layer 2–7 networking data-plane and control-plane functionality.
- Implement firmware features based on product and system requirements in collaboration with cross-functional engineering partners.
- Contribute to developer tests and system-level testing for software quality and reliability.
Requirements
- Currently pursuing a bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
- Must have at least one additional quarter or semester of school remaining after completing the internship.
- Preferred: bachelor’s degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or a related field plus 1+ years of technical engineering experience.
- Preferred: master’s degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or a related field, or equivalent experience.
Benefits
- Six-month internship beginning February 1, 2027.
- Academic credit may be available through the Microsoft Intern Program; university-specific requirements beyond academic credit are not supported.
- Base pay is listed monthly, with a different range for specific San Francisco Bay Area and New York City metropolitan area locations.
- Certain roles may be eligible for benefits and other compensation.
About Microsoft
Microsoft develops operating systems, productivity software, cloud services, developer tools, and consumer devices for individuals, enterprises, and governments. Its main products include Windows, Microsoft 365, Azure, Visual Studio/GitHub, Xbox, and LinkedIn; revenue comes from software subscriptions and licenses, cloud consumption, hardware sales, and advertising. Founded in 1975 and headquartered in Redmond, Washington, Microsoft is a public company traded on Nasdaq.