2 days ago
Responsibilities
- Lead complex platform integration, test automation, BSP enablement, and validation initiatives with minimal supervision.
- Provide technical leadership, mentorship, and guidance to engineers while influencing technical decisions and engineering practices.
- Develop and improve Python- and Shell-based test frameworks, automation tools, validation workflows, and reusable framework architecture.
- Customize and rebuild Qualcomm BSPs and lead platform bring-up and integration for automotive reference platforms including RIDE, STAR, and PATS.
- Analyze and resolve system-level issues spanning hardware, firmware, kernels, drivers, middleware, applications, networking, and operating systems.
- Collaborate with software, hardware, validation, and customer-facing teams on program execution, roadmaps, and planning.
Requirements
- Bachelor’s degree or equivalent in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
- 8+ years of Software Engineering, Systems Engineering, Platform Integration, Embedded Software, Hardware Engineering, or related experience.
- Proficiency in Python and Shell scripting for automation, test development, and system-level tooling.
- Working knowledge of HLOS internals and preferably Linux driver experience.
- Experience with embedded programming in C and/or C++.
- Experience customizing BSPs on Qualcomm or equivalent embedded platforms.
- Ability to read and interpret hardware schematics.
- Understanding of networking fundamentals and technologies such as Ethernet, TCP/IP, switching, VLANs, and automotive networking.
- Demonstrated ability to debug complex issues across hardware, firmware, operating systems, networking, middleware, and application layers.
- Experience leading complex technical projects and cross-functional initiatives.
- Preferred qualifications include experience with Yocto, Android build systems, CI/CD pipelines, Robot Framework, Qualcomm Snapdragon Automotive platforms, and mentoring engineers.
About Qualcomm
Inspired by 250 years of American ingenuity, we build technologies that expand what’s possible. From wireless to AI at scale and 6G, our innovations power progress worldwide.