Staff Engineer, ESSD Firmware
Micron Technology1 day ago
Bengaluru, India or Hyderābād, IndiaStaff+
Responsibilities
- Design, build, evaluate, bench-test, debug, and perform failure analysis on firmware for memory controllers and SSDs.
- Develop and debug firmware using assembly and C programming.
- Triage failures, file bug reports, and help development teams isolate issues.
- Work with PCIe/NVMe and other storage interfaces, including SATA or SAS.
- Use ARM development tools and integrated development environments such as Eclipse.
- Collaborate with multidisciplinary engineering teams on product development issues.
- Lead or supervise junior engineers and technicians.
- Work independently and manage multiple priorities in a cross-functional environment.
Requirements
- A BS in Electrical Engineering, Computer Engineering, or equivalent is required.
- 6–12 years of embedded firmware, storage, or SSD experience is strongly preferred.
- Strong firmware design and debugging experience with assembly and C programming.
- Knowledge of PCIe/NVMe and other storage interfaces; SATA or SAS experience is optional.
- Strong ARM development tools and IDE experience, including Eclipse.
- Experience in the SSD, HDD, storage systems, or related technology industry.
- Knowledge of NAND flash and other non-volatile storage is preferred.
- Experience using oscilloscopes and logic or bus analyzers is preferred.
- Experience leading teams or supervising junior engineers and technicians.
- Strong written and verbal communication, interpersonal, collaboration, and independent-work skills.
Tech Stack
AssemblyCSass
Categories
About Micron Technology
Micron Technology designs and manufactures memory and storage semiconductors—DRAM, NAND, NOR and SSDs—sold to device makers, cloud providers, and embedded/automotive markets. Founded in 1978 and headquartered in Boise, Idaho, it operates globally and sells under the Micron and Crucial brands as a public company (NASDAQ: MU). Its products support data center, AI, mobile, and PC systems, including high-bandwidth and multichip packages for performance- and space-constrained applications.