Staff Engineer, ESSD Firmware Developer
Micron Technology1 day ago
Bengaluru, IndiaStaff+
Responsibilities
- Build high-performance controller firmware for volatile and non-volatile memory systems, SSDs, and memory controllers.
- Evaluate, create, build, bench test, debug, and analyze failures in firmware.
- Triage failures, file bug reports, isolate issues, and support multidisciplinary product development teams.
- Recreate and trap problems, identify performance-critical algorithms, and optimize firmware performance.
- Configure and debug ASIC register settings in SoC and embedded firmware development environments.
- Scope and estimate development effort while working effectively across teams.
Requirements
- 6–15 years of embedded firmware experience, with storage or SSD experience strongly preferred.
- Strong firmware design and debugging experience using assembly and C programming.
- Knowledge of NAND flash, SSD flash translation layers, wear leveling, and garbage collection.
- Knowledge of SATA, SAS, and NVMe mass-storage interfaces; NVMe is optional but a strong plus.
- Strong skill with ARM development tools and IDEs such as Eclipse.
- Knowledge of digital hardware design is a plus.
- Experience with oscilloscopes and logic or bus analyzers is a plus.
- Experience using AI-assisted engineering tools for firmware development, debugging, automation, test generation, log analysis, and productivity improvement.
- Bachelor of Science in Electrical Engineering, Computer Engineering, or equivalent required.
- Strong communication, interpersonal, collaboration, multitasking, and problem-solving skills.
About Micron Technology
Micron Technology designs and manufactures memory and storage semiconductors—DRAM, NAND, NOR and SSDs—sold to device makers, cloud providers, and embedded/automotive markets. Founded in 1978 and headquartered in Boise, Idaho, it operates globally and sells under the Micron and Crucial brands as a public company (NASDAQ: MU). Its products support data center, AI, mobile, and PC systems, including high-bandwidth and multichip packages for performance- and space-constrained applications.