Staff Engineer, ESSD Firmware Developer
Micron Technology1 day ago
Bengaluru, India or Hyderābād, IndiaStaff+
Responsibilities
- Design, evaluate, build, test, debug, and analyze failures in firmware for memory controllers and SSDs.
- Develop firmware using Assembly and C for high-performance volatile and non-volatile memory systems.
- Work with PCIe/NVMe and other storage interfaces, including SATA or SAS.
- Triage failures, file bug reports, and help development teams isolate issues.
- Use ARM development tools, IDEs, scripting languages, programming tools, and test equipment.
- Collaborate with multidisciplinary engineering teams on product-development issues.
- Provide team leadership or supervise junior engineers and technicians.
Requirements
- 6–12 years of embedded firmware experience in storage or SSD environments is strongly preferred.
- Strong firmware design and debugging experience using Assembly and C programming.
- Knowledge of PCIe/NVMe and storage interfaces such as SATA or SAS.
- Strong ARM development-tool and IDE experience, including Eclipse.
- Experience in SSD, HDD, storage systems, or related technology.
- Knowledge of NAND flash and other non-volatile storage is a plus.
- Experience with oscilloscopes and logic or bus analyzers is desirable.
- Experience leading teams or supervising junior engineers and technicians.
- Bachelor’s degree in Electrical Engineering, Computer Engineering, or equivalent required.
- Ability to work independently, manage multiple priorities, and collaborate effectively in multidisciplinary teams.
Tech Stack
AssemblyCSass
Categories
About Micron Technology
Micron Technology designs and manufactures memory and storage semiconductors—DRAM, NAND, NOR and SSDs—sold to device makers, cloud providers, and embedded/automotive markets. Founded in 1978 and headquartered in Boise, Idaho, it operates globally and sells under the Micron and Crucial brands as a public company (NASDAQ: MU). Its products support data center, AI, mobile, and PC systems, including high-bandwidth and multichip packages for performance- and space-constrained applications.