Qualcomm

Staff Engineer

Qualcomm
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1 day ago
Bengaluru, IndiaStaff+

Responsibilities

  • Define architecture for real-time DSP and processor subsystems integrated with Linux/HLOS.
  • Own low-level software including boot, board support packages, RTOS integration, DSP services, Linux interfaces, device drivers, middleware, system services, and developer frameworks.
  • Lead technical resolution across DSP and processor cores, silicon, firmware, RTOS, Linux/HLOS, drivers, middleware, and host software.
  • Drive multi-core and heterogeneous compute architecture, workload partitioning, scheduling, memory, power, security, communication, and fault-recovery mechanisms.
  • Lead pre-silicon validation, silicon enablement, board bring-up, platform stabilization, and production readiness.
  • Optimize DSP and platform performance, power, latency, memory usage, stability, and reliability.
  • Translate customer and product requirements into architecture, milestones, and engineering plans.
  • Partner with hardware, DSP, Linux/HLOS, systems, validation, tools, applications, and customer engineering teams.
  • Lead technical reviews, root-cause analysis, and risk management for critical deliverables.
  • Mentor and manage engineers while remaining technically hands-on and accountable for delivery quality.

Requirements

  • 11+ years of experience in embedded software, DSP or processor firmware, Linux/HLOS integration, board support packages, device drivers, or platform software development.
  • Expert-level proficiency in C/C++, including assembly-level debugging and processor architecture.
  • Strong experience with RTOS environments such as Zephyr or FreeRTOS and with Embedded Linux or another Linux-based HLOS environment.
  • Deep understanding of RTOS internals, scheduling, synchronization, interrupts, exceptions, and real-time constraints.
  • Strong knowledge of Linux kernel fundamentals, user-space services, device-driver models, system startup, power management, and cross-boundary debugging.
  • Knowledge of boot flows, linker scripts, memory maps, executable formats, image loading, and firmware packaging.
  • Hands-on experience with caches, tightly coupled memory, memory protection, DMA, shared memory, coherency, and memory bandwidth optimization.
  • Experience with Linux/HLOS-to-DSP communication, multi-core synchronization, subsystem lifecycle management, and fault recovery.
  • Experience with DSP profiling, compiler optimization, vector processing, fixed-point arithmetic, low-level optimization, and performance-per-watt analysis.
  • Experience debugging hardware-software issues using JTAG, trace, crash dumps, logs, hardware instruments, Linux debugging tools, and profilers.
  • Proven experience delivering products from pre-silicon development and silicon bring-up through production.
  • Experience leading engineers while remaining technically hands-on.
  • Strong customer-facing communication, technical negotiation, and leadership skills.
  • Proficiency using AI-assisted development tools for design, implementation, debugging, documentation, and engineering efficiency.
  • Bachelor's degree in Engineering, Information Systems, Computer Science, or a related field with 4+ years of related work experience, or a master's degree with 3+ years, or a PhD with 2+ years.
  • At least 2 years of work experience with a programming language such as C, C++, Java, or Python.
  • Preferred experience with DSP firmware and Linux/HLOS integration for compute, audio, sensor, communication, imaging, or machine-learning subsystems.
  • Preferred experience with high-throughput signal-processing pipelines, fixed-point arithmetic, vectorized algorithms, latency-sensitive workloads, simulation, emulation, virtual platforms, pre-silicon validation, automated firmware testing, and production SoC safety, security, reliability, or functional-isolation requirements.

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Qualcomm

About Qualcomm

10,000+ employees

Inspired by 250 years of American ingenuity, we build technologies that expand what’s possible. From wireless to AI at scale and 6G, our innovations power progress worldwide.

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