Solutions Engineer - AE
Cadence Design Systems5 days ago
Base Salary
$127k - $237k/yr
Responsibilities
- Provide technical leadership and application support for Cadence 3D-IC design solutions.
- Assist customers with advanced package architecture, design implementation, and methodology development.
- Develop and demonstrate workflows for organic substrates, silicon interposers, wafer-level packaging, 2.5D/3D-IC integration, and chiplet-based architectures.
- Support customer evaluations, proof-of-concepts, benchmarks, and production deployments.
- Deliver technical presentations, product demonstrations, workshops, and training sessions.
- Provide technical pre-sales support in collaboration with sales teams.
- Communicate customer requirements, enhancement requests, and technology needs to R&D.
- Support design-signoff methodologies including DRC/LVS, connectivity verification, electrical rule checking, thermal analysis, signal integrity, and power integrity.
- Develop best practices, application notes, reference flows, and customer success methodologies.
- Assist in defining future product direction for advanced packaging, 3D-IC, and chiplet technologies.
Requirements
- Bachelor’s degree in Electrical or Electronics Engineering or a related discipline; a master’s degree is preferred.
- 8+ years of experience in semiconductor packaging, IC packaging, PCB, substrate, or interposer design.
- Strong knowledge of advanced package design methodologies, 2.5D/3D-IC integration, chiplet architectures, package manufacturing and assembly, high-speed signal design, and power delivery networks.
- Experience performing package layout, routing, constraint management, and package signoff.
- Understanding of package stackups, bump planning, escape routing, and substrate technologies.
- Excellent customer-facing communication and presentation skills, with the ability to work independently and across global teams.
- Preferred experience with Cadence Integrity 3D-IC Platform, Cadence Sigrity, Clarity 3D Solver, and Cadence Allegro X APD.
- Preferred knowledge of UCIe, HBM, AI accelerator packaging, heterogeneous integration, foundry and OSAT design flows, semiconductor assembly, reliability, and manufacturing processes.
Benefits
- United States role with remote or hybrid work options.
- Approximately 2% to 5% travel depending on customer demand and business needs.
- Paid vacation and paid holidays.
- 401(k) plan with employer match.
- Employee stock purchase plan.
- Medical, dental, and vision plan options.
- Potential eligibility for incentive compensation, bonus, equity, and other benefits.
Categories
Solutions Engineering
About Cadence Design Systems
Cadence Design Systems builds electronic design automation (EDA) software, emulation/acceleration hardware, and reusable IP that help semiconductor and systems companies design, verify, and implement chips and electronic systems. It also develops computational engineering tools, including computational fluid dynamics and molecular modeling for drug discovery. Founded in 1988 and headquartered in San Jose, California, Cadence is a public company listed on NASDAQ under the ticker CDNS.