Staff Design Automation Engineer
Skyworks Solutions3 hours ago
Bengaluru, IndiaStaff+
Responsibilities
- Design and build Python applications and web-based enterprise platforms for packaging and wafer-flow lifecycle management.
- Convert an existing VBA solution into a database-connected web platform with pre-tapeout inputs, post-tapeout workflows, automated triggers, and DRCs.
- Develop post-tapeout data gathering, bump-mask generation, and mechanical wafer-probing data automation.
- Support day-to-day packaging and wafer-flow activities while developing longer-term software solutions.
- Build and maintain packaging DRC rule decks and custom checks for substrates, interposers, and system-in-package structures.
- Develop AMS/RF packaging automation for placement, routing, via strategies, stack-up, pin assignment, fanout, shielding, and BOM generation.
- Manage code through GitHub using branching, pull requests, code review, and AI-assisted development tools.
- Collaborate with design, packaging, wafer-flow, test, and manufacturing teams; document flows and train users.
Requirements
- M.Tech, M.E., or M.S. in electrical or computer engineering, or equivalent.
- 3–5 years of experience in IC or module packaging design, packaging CAD, RF substrate layout, or a similar role.
- Strong Python software development experience, including tools and services that read from and write to databases.
- Experience developing web applications with front-end UIs, back-end services, and database integration.
- Working knowledge of relational databases, data modeling, schema design, queries, and multi-source integration.
- Experience with GitHub and collaborative source-control workflows such as branching, pull requests, and code review.
- Ability to translate domain knowledge and legacy spreadsheet/VBA logic into maintainable software.
- Desired experience includes VBA/Excel workflow modernization, AI-assisted development, SKILL/Python/Tcl packaging automation, Cadence Allegro Package Designer/APD, packaging DRC/LVS/DFM, wafer flows, RF packaging, and EM-aware package-interconnect simulation.
- Preferred knowledge includes laminate substrates, wirebond, flip-chip, WLP, module integration, controlled-impedance routing, and RF front-end module packaging.
Tech Stack
PythonTcl
Categories
About Skyworks Solutions
Skyworks Solutions, Inc. is empowering the wireless networking revolution. Our highly innovative analog semiconductors are connecting people, places and things spanning a number of new and previously unimagined applications within the aerospace, automotive, broadband, cellular infrastructure, connected home, industrial, medical, military, smartphone, tablet and wearable markets. Skyworks is a global company with engineering, marketing, operations, sales and support facilities located throughout Asia, Europe and North America and is a member of the S&P 500® and Nasdaq-100® market indices (NASDAQ: SWKS). For more information, please visit Skyworks’ website at: www.skyworksinc.com.