HP IQ

Senior Privacy Engineer leading privacy-by-design controls and technical privacy strategy across software, cloud, AI, and connected-device platforms. The role bridges engineering, security, legal, compliance, and product teams to manage privacy risk and regulatory requirements.

Senior Offensive Security Engineer responsible for leading penetration testing, threat modeling, and security assessments across HP IQ’s products, services, and connected devices. The role combines product security strategy with hands-on exploitation of embedded systems, firmware, hardware interfaces, and device software.

Build secure, privacy-focused software for HP IQ’s next generation of AI-enabled devices across embedded systems, PCs, and server-class workstations. The role offers hands-on work in secure boot, cryptography, device identity, hardware-backed security, and secure communications.

Build developer productivity tools, automated testing frameworks, and development infrastructure for HP IQ’s AI software stack. This hands-on role improves build, release, test, and observability systems across the organization.

Senior Platform Engineer building shared infrastructure, developer tooling, and automation across cloud and edge environments. The role focuses on improving engineering velocity, reliability, observability, and operational efficiency for distributed production systems.

Join HP IQ as a Connectivity Software Intern building on-device firmware and system software for next-generation connected devices. You’ll work on wireless protocols, device pairing, embedded AI inference, and sensing experiences.

Join HP IQ’s AML platform team as a Software Engineering Intern building the systems that power on-device agentic AI, from model optimization and fine-tuning to orchestration and inference. You’ll ship features for next-generation HP devices while learning from experienced engineers.

Join HP IQ as a Software Engineer Intern on the Cloud Services team, helping build integrated cloud solutions that support AI-powered devices and hardware products. You’ll collaborate with hardware, AI, platform, and infrastructure engineers during the Summer 2027 internship.